
Elementum 3D and OSU CDME developing advanced copper-based materials capability for additive manufacturing of RF components under Navy STTR Phase II program
In May, Elementum 3D and The Ohio State University Center for Design and Manufacturing Excellence (OSU CDME) began work on a 2-year Small Business Technology Transfer (STTR) Phase II research contract with Naval Sea Systems Command (NAVSEA). This Phase II program follows the company’s successful Phase I Base and Option efforts.
Additive manufacturing enables production of high-performance components that would otherwise not be feasible by traditional means. It also can offer improved costs and reliability by minimizing subcomponents that need to be brazed or joined and reducing other manual manufacturing steps.
The focus of the program is to develop broad capability for RF and electro-optical electronics including AM feedstock, process, design methodologies, and post processing. RF and microwave system components are often fabricated using labor-intensive manual processes like joining and bending (below, left), and it is believed that AM can help reduce labor costs and lead times for legacy system component replacement as well as enhance the capabilities of next generation components (below, right).

This work expands on Elementum’s copper feedstock and printing capabilities to include cupronickel in addition to copper offerings with high thermal and electrical conductivity, and high operating temperature capability. In Phase I work, the team demonstrated that the developed cupronickel alloy was printable with minimal porosity across a variety of geometries, could achieve surface finish meeting stringent military specs, and was readily brazed to traditionally produced components with no gas leakage, even at ultra-high vacuum levels. Signal loss testing indicated that printed, finished waveguide devices could perform comparably to commercial off-the-shelf components. We look forward to furthering development and demonstration of full capability for end-to-end AM of high-performance copper-based components.
This material is based upon work supported by Naval Sea Systems Command under Contract No. N00024-25-C-S-T036. Any opinions, findings and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of Naval Sea Systems Command.
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