Elementum 3D

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May 2023

Published · Updated

Momentumheader2023 Scaled
Product Update

Pure copper properties improved

Pure Copper

To achieve cutting edge performance, there is a constant need for advancements that push the boundaries of technology. Through rigorous materials engineering of our commercially pure copper powder feedstock, Elementum 3D is excited to announce that we have achieved increased relative density, mechanical properties (strength and elongation) and conductivity in printed components at a reduced cost compared to the previous version.

Elementum 3D’s enhanced copper feedstock boasts a remarkable as-printed density of greater than 98% that allows for parts and components with superior structural integrity right off the printer. Furthermore, the improved feedstock offers unprecedented levels of conductivity. We have achieved an exceptional 90% IACS (International Annealed Copper Standard) as-printed. A simple annealing heat treatment can deliver 95% IACS, and, for those in search of the highest possible conductivity, a hot isostatic pressing (HIP) process further enhances the conductivity to an astonishing 98% IACS.

This unprecedented level of conductivity also applies to thermal conductivity and opens up a whole new range of possibilities, particularly for industries reliant on high-performing components that demand cutting edge thermal management solutions.

Optimized Amcopper-100 Properties

A comparison of the properties is shown in the above Table for the annealed condition unless specified otherwise. More details can be found from the AMCopper-100 data sheet on our website

With our improved printable commercially pure copper feedstock, we’re not just providing a product; we’re providing a promise – a promise of unrivaled quality, performance, and endless possibilities to an array of industries such as electronics, aerospace, and automotive.

Team News

Elementum 3D Hires New Chief Financial Officer

Vivek Pathak CfoWe are excited to announced the appointment of Vivek Pathak as our Chief Financial Officer (CFO).
Mr. Pathak has more than 30 years of experience in financial leadership positions, ranging from Fortune 500 companies to more than two decades establishing financial infrastructures for high-tech Silicon Valley start-ups in several verticals. He scaled an early-stage biotech company in digital pathology to a successful acquisition by Roche. His diverse experience includes finance, international channel management, corporate strategy, acquisitions, divestitures, and joint ventures in U.S.A., Mexico, France, and India.

“We are delighted to welcome Vivek to our team,” said Elementum 3D President and Founder Dr. Jacob Nuechterlein. “Vivek is the decisive professional we need at the helm of our financials. We have complete confidence in his ability to safeguard the company’s assets and steer Elementum 3D toward our financial goals.”

New employees

Elementum 3D Staff UpdatesJordan Emery – Operations Manager

Vivek Pathak – CFO

Charlie Beecher – Sales Manager

Kathleen Mah – Engineering Intern

Marc Lamoureux – AM Technician I

Ian Desol –AM Technician I

Jose Adame –AM Technician I

Upcoming events

TRADESHOWS

SEMICON West: July 11-13  |  San Francisco, CA USA  |  Booth share with 3D Systems

FORMNEXT – November 7-10  |  Frankfurt, Germany  |  Booth 11.1-C62

Am Industry News

May Newsletter

Jamie Perozzi

VP of Technology 6K Additive

Mr. Perozzi has 20+ years of specialty metals experience with a focus on process, new product development, product management, and application engineering. Before joining 6K, Perozzi spent seven years at AMETEK Specialty Metal Products responsible for quality and process engineering. Prior to Ametek, he spent 10 years at Hitachi Metals – Metglas and 3 years at J&L Specialty Steel. Perozzi holds a BS Metallurgical Engineering degree from Penn State University.

Dr. Timothy Smith

Materials Research Engineer NASA Glenn Research Center

Tim Smith graduated with a PhD in materials science and engineering from Ohio State University in 2016. After graduating, his pathways internship at NASA Glenn research center became a full-time position. His research focuses on high temperature alloy development and characterization. He has contributed to 29 peer-reviewed publications including journals in Nature Communications and Nature Communications Materials. His research has also produced 10 new technology reports and 3 utility patents. He recently received both the Early Career Achievement Medal in 2020 and the Exceptional Scientific Achievement Medal in 2022.

Dr. Douglas Hoffman

Senior Research Scientist (SRS)/ Principal Section Technologist NASA Jet Propulsion Laboratory

Dr. Douglas Hofmann is a Senior Research Scientist and Principal at NASA’s Jet Propulsion Laboratory, where he serves as the Section Technologist for the Mechanical Fabrication and Test Section. He is also a Lecturer and Visiting Associate at Caltech in the Applied Physics and Materials Science Department. Dr. Hofmann founded JPL’s Metallurgy Facility in 2010, was a charter member of the Materials Development and Manufacturing Technology Group, and helped establish the JPL Additive Manufacturing Center. He is the Principal Investigator of the NASA FAMIS Flight Experiment and was a 2012 recipient of the Presidential Early Career Award for Scientists and Engineers from President Obama. He has spent more than 12 years working in metal additive manufacturing and has over 30 granted patents and over 60 peer-reviewed publications.

Dr. Jacob Nuechterlein

President/Founder Elementum 3D

Dr. Jacob Nuechterlein is the founder and president of Elementum 3D in Erie, CO. He earned his Bachelor of Engineering, Master of Science, and Doctor of Philosophy at the Colorado School of Mines. Jacob has been researching, teaching, or consulting on topics such as casting and powder metallurgy for the last 14 years. Elementum 3D’s work with powder bed laser additive manufacturing is based on these principles. In addition, is thesis work in thermodynamics and formation kinetics of metal matrix composites is directly related to all 3D printing processes.